Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide

Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility.

Molding and Sinter Systems
Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.

Boschman Advanced Packaging Technology

Eef Boschman

This department focuses on the design, analysis, and development of mechanical systems and components.

Mechanical Engineering

This department focuses on engineering support, testing, and production processes.

Engineering Services

This department focuses on designing, developing, and testing software and embedded systems.

Engineering Department

This department manages financial operations and administrative support functions.

Finance and Administration

This department focuses on innovative solutions and technologies in advanced packaging.

Advanced Packaging

This department focuses on the design and development of advanced engineering solutions for packaging and molding processes.

Boschman Advanced Packaging Technology

Org chart

Teams

Mechanical Engineering

Engineering Services

Engineering Department

Finance and Administration

Advanced Packaging

Engineering and Development

Offices

Boschman Advanced Packaging Technology

Org chart

Teams

Mechanical Engineering

Engineering Services

Engineering Department

Finance and Administration

Advanced Packaging

Engineering and Development

Offices

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