Bo Wu is a PhD and high-speed chip scientist specializing in mixed-signal IC and system design for wire-line and optical communication applications. Currently a Principal R&D Hardware Engineer at Broadcom Inc., Bo is involved in the development of advanced physical layer products, including high-speed DAC/ADC and transceivers. Previously, Bo designed a SiGe-based low noise amplifier chip as an RFIC Designer at NXP Semiconductors and conducted research on network algorithms as a visiting student at INRIA, France. Bo earned a Doctor of Philosophy in IC Design from The University of Texas at Dallas.
This person is not in the org chart
This person is not in any teams
This person is not in any offices