Boon Teong Cheah is currently a Staff Reliability Engineer at Broadcom, where they have been contributing to the WSD Reliability and Quality Department since 2017. With over 10 years of experience in IC manufacturing, Boon specializes in IC and RF testing, reliability testing, failure analysis, and new product setup. Previously, they served as a Senior Process Engineer at Renesas Electronics Corporation from 2008 to 2017 and completed an industrial traineeship at Globe Engineering Sdn Bhd in 2007. Boon holds a Bachelor of Engineering in Manufacturing Engineering from Universiti Malaya and an Advance Diploma of Management from AIM Education & Training.
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