Chunpo Pan, Ph.D., is currently a Principal IC Design Engineer at Broadcom. They previously held positions as a Principal Engineer at Huawei Canada, where they initiated and led university collaboration projects in optical communication solutions. Chunpo also served as a DSP Engineer at Ciena and engaged in research roles at Alcatel-Lucent and the University of Toronto. They earned a BASc in Engineering Science, a MASc in Electrical and Computer Engineering, and a PhD in Electrical and Computer Engineering from the University of Toronto.
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