Daijiao Wang

Daijiao Wang is currently the Thermal Technical Lead at Broadcom Limited, where they oversee a team of six engineers in the development of advanced thermal technologies and thermal architecture design for a wide range of products. With prior experience as a Sr. Thermal Mechanical Engineer at AMD and a Staff Thermal Engineer at GrafTech International, Daijiao has cultivated extensive expertise in electronics thermal design analysis, fluid mechanics, heat transfer, and thermodynamics. They hold a PhD in Thermal Fluids in Mechanical Engineering from The University of Texas at Austin and are pursuing further degrees in Thermal Engineering at Shanghai Jiao Tong University.