Ehsan Esfahani is a mechanical engineer with over 12 years of experience in Finite Element Analysis (FEA) and is currently a Staff R&D IC Packaging Engineer at Broadcom. Previously, Ehsan served as an R&D Engineer at IKCO and held various internships, including positions at SAPCO, MAPNA Group, and HEPCO. Ehsan has also worked as a Staff and Principal Engineer in R&D Engineering Memory Technology at Western Digital from 2020 to 2022. Ehsan earned a Doctor of Philosophy in Aerospace Engineering/Engineering Mechanics from Iowa State University, where they also contributed as a Graduate Research and Teaching Assistant.
Location
Los Angeles, United States
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