Faizul Alam is a highly experienced Principal Engineer at Broadcom since June 2013, specializing in deck development and support, with expertise in 10nm, 16/14nm, 20nm, and 28nm technologies, encompassing DRC, LVS, ANT, ERC, FILL, and PERC. Previously, Faizul served as a Runset/FDK Developer at Intel Corporation from 2011 to March 2013, focusing on 14nm and 22nm runset development and support. Earlier experience includes roles at TI, Banderacom, Motorola, and IBM, where responsibilities ranged from physical design integration and methodology development to leading custom physical design methodologies for complex projects. Faizul holds a M.Sc. in Electrical & Electronic Engineering and an MS in Electrical & Computer Engineering from Bangladesh University of Engineering and Technology and the University of Florida, respectively.
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