Galen Kirkpatrick

Galen Kirkpatrick is a seasoned engineering professional with over two decades of experience in the semiconductor industry. Currently serving as Master Engineer at Broadcom since June 2011, Galen established innovative flip chip PoP packaging with a 0.4mm pitch memory stack, a pioneering achievement in the industry. Previous roles include Senior Manager at Knowles Corporation, overseeing the development of new MEM’s microphone products; Director of Technology/Sales at Signetics High Technology, where Galen expanded product portfolios; and Manager positions at TelASIC Communications, Accelerant Networks, and STATS ChipPAC Ltd., focusing on IC packaging and operations management. Galen's career began as a Senior Process Engineer at ABPAC, followed by a role as Product Development Engineer at LSI Logic, where Galen contributed to new packaging technologies. Galen holds a Bachelor of Science degree from California Polytechnic State University-San Luis Obispo.