Henry Feng

Henry Feng has over 16 years of experience in the semiconductor and technology industries. Currently serving as a Presales AE at Broadcom Limited since June 2015, Henry previously held the position of Senior FAE at Marvell Semiconductor from May 2010 to June 2015, focusing on field application engineering for Xelerated NPU and Marvell TM. Earlier in the career trajectory, Henry worked as an ASIC Engineer at Huawei from April 2007 to April 2010, specializing in digital logic design and verification for TM ASIC chip projects. Henry holds a Master of Engineering degree in Communication and Signal Processing from Northwestern Polytechnical University, obtained in 2007.