Henry Kuo is a highly experienced Senior Principal IC Design Engineer at Broadcom, where involvement spans all design and production aspects as chip lead since February 2007. Previously, Kuo held the position of Principal IC Design Engineer, focusing on front-end design, verification, and back-end timing closure for next-generation communication chips. Prior experience includes serving as a Senior Hardware Design Engineer at Sun Microsystems, specializing in high-speed, low-power register file design, and timing optimizations, as well as a Design Engineer at ATMEL Corporation, focusing on programmable logic device circuit design. Kuo holds a Master's and Bachelor's of Science in Electrical Engineering from UCLA, obtained between 1989 and 2001.
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