Hsien-Ching Lo is a foundry engineer at Broadcom Inc. with 14 years of experience in the semiconductor industry. They have held various prestigious roles, including deputy director and manager at GLOBALFOUNDRIES, where they led process integration and customer engagement for 14nm technologies. Hsien-Ching previously contributed to product yield enhancement as a senior member of technical staff at AMD and has significant experience in technology transfer integration from their time at TSMC. They are currently pursuing advanced degrees in materials science and electrical engineering while holding a Ph.D. in electrical engineering from National Tsing Hua University.
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