Hyunsuk Chun is a Principal Packaging Development Engineer at Broadcom, specializing in packaging architecture and development, with a strong expertise in integrated circuit packaging technology, including FCBGA and 2.5D packaging. Previously, they held positions at Broadcom and Micron Technology, where they focused on innovative package solutions, thermal interface material development, and reliability testing. Hyunsuk earned a Bachelor's and Master's degree in Materials Science and Engineering from Sungkyunkwan University, followed by a Ph.D. in Materials Science from the University of Maryland.
This person is not in the org chart
This person is not in any teams
This person is not in any offices