Jansen An is an accomplished engineering professional with extensive experience in technology development and alignment across various industries. Currently serving as Principal Engineer at Broadcom since March 2019, Jansen An drives technology initiatives within the 2.5D Fan-Out business groups, collaborating with R&D and OSAT teams. Prior to this role, Jansen An was a Senior Staff Engineer at Qualcomm from February 2013 to September 2017, focusing on RF SiP technology development. Jansen An also held key positions at Amkor Technology, Inc., including Sr. Director of the FCBGA Product Group, overseeing technology alignment between US and non-US operations, and Group Manager of Advanced Material Development, contributing to the creation of various advanced materials. Earlier experience includes a Sr. Researcher of Product Development role at UTAC, specializing in cutting-edge packaging technologies. Jansen An holds a Master's degree in Materials & Science Technology from California State University, Long Beach.
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