Jason Crop

Power Thermal IC Design Engineer

Jason Crop is an experienced Power Thermal IC Design Engineer at Broadcom, specializing in developing solutions for power and thermal challenges within the 3DIC ASIC team since April 2024. Previously, Jason served as a Power Performance Validation Principal Engineer at Intel Corporation from January 2005 to March 2024, where expertise included power validation, performance optimization for Intel Server products, and power analysis. Prior to this role, Jason was a Senior Design Engineer at Intel, leading full-chip integration for timing, power, and noise across Intel Xeon and Itanium designs. Jason's career began at Hewlett-Packard as a VLSI Design Engineer, focusing on post-silicon debug and physical design for PA-RISC products. Jason holds both a Master of Engineering and a Bachelor of Engineering in Electrical Engineering from Brigham Young University.

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