Javed Sandhu

Director R&d - IC Package Engineering at Broadcom

Javed Sandhu possesses extensive experience in the field of integrated circuit package engineering, having held senior management and engineering positions at Broadcom Inc. and ASAT, among others. At Broadcom Inc., Javed has served as Senior Manager of R&D in IC Package Engineering, as well as Manager and Principal Packaging Engineer. Prior to this, Javed was Senior Manager of Design at ASAT and held the position of Senior Package Design Engineer at Custom Silicon Configuration Services - CS2. Javed's academic background includes an MBA in Corporate Finance from Solvay Business School in Brussels and a BSEE in Electrical Engineering from Vesalius College, also in Brussels.

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