Jin Chen

Jin Chen is a Senior IC Package Design Engineer at Broadcom, where they focus on designing and developing innovative IC packaging solutions. They have extensive experience in managing new product introduction activities, collaborating with cross-functional teams, and resolving manufacturing challenges. Previously, Jin interned at Lockheed Martin, Texas Instruments, and Qorvo, Inc., where they contributed to mechanical design, packaging solutions, and process improvements. Jin holds a Bachelor of Science and a Master of Science in Mechanical Engineering from The University of Texas at Dallas, graduating with high honors.