JoonYeob Lee is a Principal Engineer at Broadcom Inc., where they drive technology development and align advanced package technology among cross-functional teams since 2018. With over 27 years in semiconductor packaging, JoonYeob's previous roles include Senior Staff Engineer at Qualcomm and Senior Director at Amkor Technology, where they managed technology alignment and overseen product development. JoonYeob also contributed to material development as a researcher at the Korea Institute of Science and Technology and STATS ChipPAC. They earned a Master's degree in Materials & Science Technology from Korea University in 1999.
This person is not in the org chart
This person is not in any teams
This person is not in any offices