Li Sun is a seasoned expert in electronic packaging, currently serving as the Senior Manager of Packaging Solutions at Broadcom Inc. Since 2016, Li has been managing global packaging teams, driving innovation in various packaging technologies, and defining strategies for enhanced product performance. In previous roles, Li played pivotal roles in developing Cu pillar technology and managing packaging development projects, gaining extensive experience in system design and reliability improvement. Li holds a Ph.D. in Mechanical Engineering from the University of Arkansas and has contributed to significant advancements in MEMS and packaging solutions throughout their career.
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