Qian Ding is an experienced IC Packaging Design Engineer currently working as a Principal IC Design Engineer at Broadcom since 2025. Previously, Qian held positions such as Packaging Engineer at Entropic Communications from 2011 to 2015, Hardware Engineer at Oracle from 2015 to 2017, and Packaging R&D Engineer at Intel Corporation from 2018 to 2025. Additionally, Qian served as a Research Assistant at the Computational Electromagnetics group at the Center for Magnetic Recording Research from 2009 to 2013, and worked as a Teaching Assistant for various labs and courses at the University of California, San Diego in 2011. Qian earned a degree from the University of California, San Diego from 2009 to 2012.
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