Qifeng Wu is a Principal Engineer in Finite Element Analysis (FEA) at Broadcom, specializing in mechanical simulation of electronic packages and systems. They hold a Ph.D. in Mechanical Engineering from North Carolina State University, where they focused on solid mechanics and multi-physics simulation. With extensive industrial R&D experience, Qifeng has developed finite element modeling methodologies for semiconductor packages and has contributed to software development for modeling automation. Their research has resulted in 14 peer-reviewed publications, and they previously held engineering roles at Intel Corporation.
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