Rizwan Ghaffar

Principal Engineer

Rizwan Ghaffar is a Principal Engineer at Broadcom Inc. since July 2019, specializing in the development of advanced WiFi chipsets for high-end devices. Prior to this role, Rizwan served as Technical Lead for NR/5G Wireless at Intel Corporation, focusing on baseband receiver design. At Samsung Semiconductor, Rizwan contributed to modem chipset design for the Galaxy S6/S6 Edge and performed optimization tasks. Rizwan's academic tenure includes postdoctoral research at the University of Waterloo, where significant work was done on LTE and MIMO systems, as well as a Research Engineer role at EURECOM, contributing to the OpenAirInterface platform. Rizwan holds a PhD in Wireless Communications from Télécom Paris and has published extensively throughout an academic career that includes visits to the University of Patras and a Master's degree in Signal and Digital Communications.

Location

San Jose, United States

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