Rui Zhang is a Principal Packaging Engineer at Broadcom with over 17 years of experience in advanced packaging, including 2D, 2.5D, and 3D technologies. Previously, Rui served as a Principal Engineer at Samsung Semiconductor US, where they defined technology portfolios and collaborated with foundries to develop packaging solutions for AI and datacenter applications. Rui also held positions at Intel Corporation, Apple, and other leading companies, focusing on process development and innovation in electronics packaging. They earned a Ph.D. in Electronics Assembly and Packaging from Auburn University, along with a Master's degree from the same institution and a Bachelor's degree in Electrical Engineering from Tsinghua University.
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