Shen Cheng is an experienced IC Design Engineer with a significant background in ASIC projects, currently serving as a Principal IC Design Engineer at Broadcom Inc. since April 2019. Shen has worked on advanced projects including 7nm Read Channel SoCs and 3nm HBM3/4 Bridge Chiplet within 2.5D/3D IC architectures, demonstrating the ability to quickly adapt and manage complex IP blocks while efficiently debugging legacy designs. Prior to Broadcom, Shen held the position of Staff Digital Design Engineer at OmniVision for nearly nine years, leading ISP design for image sensor products, guiding junior engineers, and delivering various digital interface IPs. Shen holds a Master of Science in Computer Science and Engineering from Santa Clara University, a Master's in Computer Engineering from the Rochester Institute of Technology, and a Bachelor of Science in Electrical and Information Engineering from East China University of Science and Technology.
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