Soon Keat Chew has over a decade of experience in the semiconductor industry, beginning as a Product Engineer at GTek from August 2004 to August 2010, where responsibilities included conducting new product introduction (NPI) and building prototypes for customers. Soon Keat then served as a Product Engineer at Intel Corporation from September 2010 to July 2015, focusing on high-volume manufacturing (HVM) issues and providing guidance to junior engineers while managing multiple product lines. Since July 2015, Soon Keat has worked as a Test Engineer at Broadcom Limited, specializing in the characterization and qualification of new ASIC products. Soon Keat holds a Bachelor of Applied Science in Engineering Physics from Universiti Sains Malaysia, obtained between 2001 and 2004.
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