Svensson Chai is a Principal Thermal Mechanical Engineer at Broadcom Limited Penang, with extensive experience in the semiconductors and desktop/server industries. Chai has a strong background in thermal system design and testing, having previously served as a Thermal Mechanical Engineer at Hewlett-Packard from 2010 to 2016. Chai holds a Master of Engineering in Power Mechanical Engineering from National Tsing Hua University and a Bachelor of Engineering in Mechanical Engineering from National Sun Yat-sen University.
Location
Bayan Lepas, Malaysia
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