Syam Yadlapati is a Principal IC Design Engineer at Broadcom Inc., where they have been since 2017. With hands-on experience in all phases of ASIC physical design, Syam successfully taped out multiple designs in various technology nodes, including 28nm, 40nm, and 65nm, leveraging their expertise in Place & Route, Extraction, and Power Analysis. Previously, they held positions such as Sr. Staff Engineer at Broadcom Inc. and Sr. ASIC Design Engineer at Emulex, contributing to numerous successful tapeouts and gaining proficiency in a wide range of EDA tools. Syam holds a Master's degree in Electrical Engineering from San Jose State University and a Bachelor's degree in Electronics and Communications from Jawaharlal Nehru Technological University.
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