Terry Su possesses extensive experience in IC packaging and design, having held positions at several leading technology companies. At Qualcomm, Terry served as a Staff Engineer in IC Packaging Development & Design, and similar roles were undertaken at Apple Inc. and Trident Microsystems. Additionally, Terry contributed to the DataCenter Engineering Group at Intel Corporation. Academic credentials include a Master's degree in Electrical and Computer Engineering from UC San Diego, earned between 2003 and 2007.
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