Pricing
Broadcom
Unverified
Packaging Engineering
19 people · 0 jobs
This department is responsible for the design, development, and analysis of packaging solutions for integrated circuits and semiconductor products.
Adam Chaimowitz
IC Package Design Engineer
Adam Gallegos
Semiconductor Packaging Engineer
Anna Chen
Principal Packaging Engineer
Carl Li
IC Packaging Design Engineer
Hank C.
Staff Packaging Engineer
Henry Kim
Senior Principal Packaging Engineer
HW Liau
Principal Engineer (Packaging Engineering)
Jiaqi Wu
IC packaging Engineer
Joe Mayo
Packaging Failure Analysis Engineer
Marcella Michelle
IC Packaging Engineer
Marwan Abu-Mahaimed
Lead package design engineer
Ophelia Tong
Qianwen Chen
Principal Package Engineer
Rob Martin
Ryan Knight
Packaging Engineer
Shuai Shao
Swanson Derek
Zhimin Wan
IC Package Engineer
Zijie Cai
No jobs in this team
View all teams
1923 people · 0 jobs
1313 people · 0 jobs
605 people · 0 jobs
478 people · 0 jobs
188 people · 0 jobs
162 people · 0 jobs