建良 陳 is a Senior Project Engineer at Butterfly Network, Inc., where they are currently focused on MEMS package yield improvement and supplier management. Previously, they served as a Senior NPI Engineer at Tong Hsing Electronic Ind., specializing in semiconductor package development and coordination for new product introductions (NPI). They also held roles as an NPI Engineer and Research and Development Engineer, contributing to innovations in MEMS and RF device packaging. 建良 obtained both a Master's and Bachelor's degree in Materials Sciences from 大同大學.
This person is not in the org chart
This person is not in any teams
This person is not in any offices