Ryan Parrott

Ryan Parrott is an innovative and results-driven Senior Packaging Engineer currently serving as the Pathfinding Lead at Intel Corporation. With nearly two decades of experience, Ryan has excelled in packaging design, logistics optimization, and supply chain innovation, delivering cost-saving initiatives and managing complex projects from concept to implementation. Ryan previously held several roles at Intel, including Packaging Engineer and Manager, where they led cross-functional teams and contributed significantly to new product introductions and cost-saving efforts. Ryan is also a member of the Board of Advisors for the Cal Poly Packaging Program, supporting ongoing development in the field.