Darius Adamczyk

Chairman and CEO, Honeywell, Darius has been Chairman since 2018. He has served as both President, CEO, and President, COO. Joining Honeywell as CEO, Metrologic, he was President, Scanning and Mobility, and President, Process Solutions before being named President, CEO, Performance Materials and Technologies. Darius has an MBA, Harvard University, M.S., Computer Engineering, Syracuse University, and B.S., Electrical and Computer Engineering, Michigan State University. He serves on the US-China Business Council, Business Roundtable, Business Council and Council on Foreign Relations.