Bill Tian

Bill Tian is an Assembly Engineering Manager at Carsem, where they focus on R&D and NPI for RF PA/switch/LNA and MEMS. With a decade of experience, including seven years in semiconductor assembly and three in SMT processes, Bill has developed strong project management skills over five years in semiconductor assembly and testing. Previously, they held positions at Statschippac as a Senior Project Engineer, Diode Shanghai as an R&D Product Manager, and ASEN as a Project Manager. Bill earned a Bachelor’s degree in Fine Chemistry from Anhui University of Science and Technology and a Master’s in Project Management from Nanjing University.