Leon Lee is an experienced FOL Process Engineering Manager at Carsem, where they are responsible for the development and improvement of FOL Die Attach processes. Previously, Leon held roles at companies such as ASE Group, UTAC, and Fairchild Semiconductor, where they focused on process engineering and improvement strategies. Leon earned a diploma in Electrical and Electronics Engineering from ITP Lebuh Victoria and has a strong track record in yield improvement, process optimization, and cross-functional team collaboration.
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