Sandeep Gaan is a seasoned professional with over 15 years of experience in the semiconductor industry. Currently, they serve as the Senior Manager for 2.5D/3D packaging process development at Celestial AI, where they lead efforts in advanced IC packaging. Previously, Sandeep held several key positions at Intel Corporation, including Senior Business Development and Operations Manager, and Staff Packaging R&D Engineer. Sandeep earned a Ph.D. in Physics from Carnegie Mellon University, where they focused on advanced scanning tunneling spectroscopy and electronic transport studies.
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