Andy Carrasco is an experienced IC Package Design Engineer with a robust background in the electronics and semiconductor industries. They currently serve as a Technical Leader in Hardware Engineering at Cisco while previously holding leadership roles at companies such as Nagase & Co., Ltd., Nippon Sentia Co., Ltd., and Flexetch. Andy has a Master of Business Administration from Temple University Japan and a Bachelor of Arts from the University of California, Berkeley. Known for their expertise in IC package technology, business development, and customer relationship management, Andy has made significant contributions to high-tech development and has authored numerous technical documents and specifications.
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