Hai Liu is a passionate innovator in MEMS sensors and electronics/photonics packaging, with over 18 years of experience. Currently serving as a technical leader for photonics and semiconductor packaging at Cisco in Holmdel, NJ, Liu is focused on advanced packaging for high-speed optical transceivers. Previously, as a Staff MEMS Packaging Engineer at TDK InvenSense, significant contributions included leading advanced packaging development for various MEMS products. Liu earned a Ph.D. in Electrical and Computer Engineering from the University of Southern California, where research on piezoelectric MEMS resonant microphone arrays led to an Outstanding Paper Finalist Award at the MEMS 2020 conference. Prior to graduate studies, Liu gained expertise in semiconductor packaging at Samsung, where notable achievements included patent grants and several peer-reviewed publications.
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