Patrick Liu

Patrick Liu has over 15 years of experience in semiconductor packaging, specializing in technologies such as Flip-Chip, CoWoS, and Fan-Out. Currently, Patrick is a Technical Leader at Cisco, where they support various package and substrate technologies and conduct qualification for advanced package products. Previously, Patrick worked as a Silicon Package Development Engineer at Meta, managing assembly and manufacturing for innovative packages. They also held roles at several other companies, including TSMC and 新思國際科技有限公司, with a solid foundation in materials science earned from National Taiwan University, where Patrick attained both a master's and a bachelor's degree.