Reed An has over a decade of experience as a project manager, currently leading the Marker Pen transfer project at Colart since January 2013. Prior experience includes managing the Nokia stamping and overmolding project, as well as the Conductive Silicone for extrusion and compression molding project at Laird Technologies from 2005 to 2013. Additionally, Reed An was involved in display stamping and injection molding for TPE solutions at Laird Technologies, Inc. from 2005 to 2012. Reed An holds a Bachelor's degree in forging and stamping processes and equipment from the machine mechanical and electronical branch of Tianjin University, obtained between 1988 and 1992.
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