Theodor Maier is a seasoned expert in microelectronic integration and semiconductor technologies with over three decades of experience in the automotive industry. Currently serving as the Head of Microelectronic Integration at Continental since December 2008, Theodor Maier oversees the global development of customized integrated circuits (ICs) and interconnection technologies for automotive applications. Previous roles include Global Manager for ASIC Development at SIEMENS VDO Automotive AG and Head of Central ASIC Development at SIEMENS Automotive SA. Theodor Maier's extensive background encompasses managing design centers across Europe, the USA, and Asia, developing innovative integration concepts, and successfully introducing new ICs and technologies. Theodor Maier holds a degree in Electronic Engineering from Ostbayerische Technische Hochschule Regensburg.
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