Mike Li

Mike Li has over 14 years of experience in the semiconductor industry with roles varying from Director to Vice President. Mike began their career in Sequoia Communications, where they served as Director of IC Engineering. During their tenure, they built and managed the digital/mixed signal team, delivering two RFICs, which secured design wins from global leading handset makers in 3G wireless communications. Mike played a key role in designing DAC/ADC, digital baseband, and PLLs.

Mike then moved to Avago Technologies and worked as Director, CMOS Engineering, where they worked on CMOS-based digital and mixed signal design in the Wireless Semiconductor Division. Mike introduced innovative signal processing and RF control/calibration solutions, created digital on top and analog on top design flows, and developed NI PXI based bench testing and probing platform.

Li later joined Inphi Corporation, where they worked as a Technical Director. In this role, they drove the evolution of 16nm and 7nm FinFET technology and led vendor comparison, library and IP evaluation, and power/performance/area analysis for mixed signal processing. Mike established a company-wide cross flow low power methodology.

After Inphi, they joined NovuMind Inc. as Vice President of Engineering, driving architecture innovations for AI accelerators. Mike directly supervised the Algorithm & Architecture Team, led computer vision and neural network research, and played a pivotal role in designing convolutional neural network (CNN) processor unit (NPU) and SoC level architecture design. Mike also authored multiple patents in improving CNN arithmetic efficiency and accuracy.

Li is currently working at Corigine as VP of Engineering and New Products. Mike is leading engineering management for 6nm SmartNIC/DPU Chiplets and driving the road map, system and solution architecture for SmartNIC chiplets. Mike is also managing external fab relationships, leading IP evaluation and acquisition.

Mike Li has a Bachelor of Science degree in Communications Engineering from the University of Electronic Science and Technology of China. Mike also has a Master of Science degree in Electrical Engineering from New York University - Polytechnic School of Engineering. Mike has also taken courses in Mixed Signal Design and high speed ADC architecture through Stanford University's SCPD program, but it is unclear if they obtained a degree from this program.