Corintis
Raphaël Blanchet is a Thermal Mechanical Engineer currently employed at Corintis since May 2024. Prior to this role, Raphaël served as a Product Engineer in Bike Accessories at Scott Sports SA from June 2019 to October 2023, specializing in bike lights, floor pumps, and carriers, utilizing Finite Element Analysis tools like Ansys Discovery for product optimization. Raphaël has also held various positions at SteriLux SA, including Manufacturing Manager and Operation Manager, where responsibilities included improving product efficiency, managing a team, establishing production lines, and implementing a Quality Management System leading to ISO 13485:2016 certification. Starting with an internship at SteriLux focusing on redesigning an ozone sterilization prototype, Raphaël also gained experience as a Mechanical Engineer Assistant at Imina Technologies SA, developing innovative solutions for probe holder technology. Educational background includes a Master’s degree in Ergonomics, Design, and Mechanical Engineering from UTBM, with ongoing studies at the University of Liège and Ulster University.
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Corintis
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.