Thomas Wagner is an accomplished professional in the field of packaging engineering with extensive experience spanning over two decades. Currently serving as the Head of Packaging at Corintis since November 2025, Wagner leads the Thermal Testing Team to develop the Therminator platform for advanced package architectures. Prior roles include Project Manager at Infineon Technologies, where Wagner drove various package designs and collaborated on the first eWLB package technology, as well as multiple engineering positions at Intel Deutschland GmbH that focused on enabling package technologies and improving assembly processes. Additionally, Wagner acted as a Lead Mentor within the Intel Ignite program, supporting technical startups. Wagner holds a Dipl.-Eng. degree in Microelectronics from Technische Hochschule Nürnberg Georg Simon Ohm, attained between 1994 and 2000.
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