En Cao

En Cao is a seasoned engineering professional with extensive experience in software development for the semiconductor and electronics industries. Currently serving as Principal Engineer at CyberOptics since June 2008, En Cao leads a team focused on Solder Paste Inspection machine software. Prior to this role, engagements included Principal Engineer at Oerlikon, where oversight of ESEC wire bonder software development occurred, and Staff Software Engineer at Kulicke and Soffa, where leadership of a wire bonder software team took place. Early career contributions include Senior Engineer at Motorola TTPCom Product Group, developing software for assembly and inspection machines, and Principal Engineer at Vital Technology Pte Ltd, dedicated to machine vision applications. En Cao’s foundational experience includes academic roles at Beihang University, culminating in advanced degrees in Electrical and Electronic Engineering and a focus on computer graphics.