Tj Eichman

TJ Eichman is an experienced Solutions Architect at Deca Technologies since November 2021, previously serving as a Senior Substrate Design Engineer at NXP Semiconductors from December 2015 to November 2021, where responsibilities included Flip Chip substrate design. Prior to that, TJ held the position of Systems and Documentation Coordinator at NXP, focusing on integration and methodologies. With a background at Freescale Semiconductor from February 1993 to December 2015, TJ coordinated design rules and methodologies and served as a Subject Matter Expert for design data management. Early career experience includes working at Motorola as a Package Design Engineer, specializing in PBGA substrates design and documentation standards. TJ holds a BS in Business Administration from LeTourneau University (2004-2006) and an AAS in Engineering Design Graphics from Austin Community College (1990-1993).