Michael Dang is an accomplished thermal engineer with a Bachelor of Science degree in Mechanical Engineering from The University of Texas at Austin, completed in 2020. Michael's professional experience includes a summer internship at Microbonds in June 2019 and a role as Senior Thermal Engineer at Dell Technologies in July 2025, where responsibilities included automating thermal testing processes with Python, developing thermal testing tools for the Dell OEM organization, and designing innovative thermal solutions for various products. Additionally, Michael has contributed to the characterization of thermal performance for advanced cooling solutions used in high-performance GPUs.
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