Gary E. Dickerson

President, Director & CEO at DFMSim

Gary Dickerson was named president of Applied Materials, Inc. in June 2012 and appointed chief executive officer and a member of the board of directors in September 2013. Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Mr. Dickerson is a long-time industry leader with more than 35 years of semiconductor experience and a strong track record of delivering profitable growth and gaining market share while achieving recognition for outstanding customer satisfaction.

For each of the past three years, Mr. Dickerson has been named one of the "World’s Best CEOs" by Barron’s for delivering solid performance and a compelling growth strategy. He also ranked among Forbes’ list of “America’s Most Innovative Leaders” for 2019 and Harvard Business Review’s "Best-Performing CEOs in the World" for 2018. He currently serves on the board of directors of the U.S.-China Business Council.

Prior to Applied Materials, he was CEO of Varian Semiconductor Equipment Associates, Inc. for seven years, until its acquisition by Applied Materials in 2011, and spent 18 years at KLA-Tencor Corporation where he held a variety of operations and product development roles before serving as president and chief operating officer. He began his semiconductor career in manufacturing and engineering management at General Motors’ Delco Electronics Division and AT&T Technologies.


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