Reid Wang is a Lead TS&D Manager and Product Technology Leader for Adhesives and Functional Materials at The Dow Chemical Company, where they have been employed since 2012. Prior to this role, Reid held positions including TS&D Manager and Application Technology Leader at The Dow, as well as Technical Service Manager for Pressure Sensitive Adhesives and Application Specialist at National Starch & Chemical. Their experience spans over a decade in adhesive technology and application support.
This person is not in any teams
This person is not in any offices