Brian Smith is an experienced professional in advanced electronics packaging and microelectronics, currently serving as Group Leader for Microsystems Integration and Principal Member of the Technical Staff at Draper since January 2009. Prior to this role, Brian worked as a Postdoctoral Researcher at IBM Zurich from October 2007 to December 2009 and was a Doctoral Candidate at Carnegie Mellon University between August 2002 and March 2007. Additional experience includes serving as an Electrical/Mechanical Engineer at Harris Corporation from June 2000 to January 2007. Brian holds a degree from Carnegie Mellon University, earned between 2002 and 2006.
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