Will Liu

Application Engineer at DSP Concepts

Will Liu has worked in the technology industry since 2010. Will began their career as a Software Engineer at New Kinpo Systems Inc. from 2010 to 2012. During this time, they worked on Windows embedded and power monitoring systems. From 2012 to 2014, they worked as a Software Engineer at Azurewave Technology, where they developed wireless connectivity drivers or applications on Android, Linux, Windows embedded, and other embedded OS. From 2014 to 2021, Will Liu worked as an Assistant Manager at Unimicron International Electronic Co. Ltd., where they implemented audio algorithms on Qualcomm ADSP, served as the project leader of HTC flagship phones, and worked on DSP porting and machine learning. Currently, Will Liu is an Application Engineer at DSP Concepts, where they support customer integration of Audio Weaver and Voice UI solutions, as well as develops enhancements to their solutions.

Will Liu completed their Bachelor's degree in Information Management from National Chi Nan University in 2009. Prior to that, they obtained their Bachelor's degree in Information Science from Chinese Culture University in 2007.

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