Dimple Das is a Solution Integrator with experience at Ericsson in 2021. Previously, Dimple served as an Associate Engineer Trainee, and participated in internships at companies such as Ericsson India and Assam Electronics Development Corporation Limited. Dimple also held roles as a Lead Editor for The Editorial Board at Sikkim Manipal Institute of Technology and as Vice President of the Electronics and Communication Students Association. Dimple graduated with a Bachelor of Technology in Electrical, Electronic, and Communications Engineering from Sikkim Manipal Institute of Technology in 2020.
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